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The microstructure and shear strength of joints between Cu–Al2O3 (50vol.% Al2O3) composite and Cu metal brazed with 72Ag–28Cu and 70Cu–30Zn filler metals were characterized. The composite fabricated by the pulsed electric current sintering of Cu-coated alumina particles showed less than 2% residual porosity and interesting thermophysical properties for electronic packaging applications; thus, the...