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We demonstrated fully automated in-line atomic force microscopy (AFM) for local height variation monitoring solution. Two use cases, which are local variation of SADP Fin height and oxide recess height in Fin reveal process and that of Cu nail protrusion and Cu pad recess height in wafer-to-wafer hybrid bonding process were evaluated in order to evaluate in-line AFM capability as a metrology solution...
We investigate multi-stack dielectric wafer bonding through two integration schemes, which provide different paths to realize vertical integration of multiple device layers. Key process steps are evaluated and optimized to enable void-less bonds at different bonding layers. Meanwhile, issues related to the wafer edge are discovered during the backside processing and the impact is analyzed. Finally,...
High performance 3D integration Systems need a higher interconnect density between the die than traditional µbump interconnects can offer. For ultra-fine pitches interconnect pitches below 5µm a different solution is required. This paper describes a hybrid wafer-to-wafer (W2W) bonding approach that uses Cu damascene patterned surface bonding, allowing to scale down the interconnection pitch below...
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