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Metallic wafer bonding is today becoming a key enable technology in MEMS packaging and heterogeneous integration. The Si/Al/Sn-Sn/Al/Si bonding structure with low temperature, low pressure and short bonding time is investigated in this paper. The bonded 4 inch Si wafers were diced into dies. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were applied for interface...
A novel micro-Pirani vacuum gauge applied in micro-system packages has been experimentally investigated. The gauge consists of a micro metal hot-wire, which is bonded on the pads of the LTCC substrate of a microsystem package and hangs over a cavity micromachined into the substrate. With a simple structure, this gauge may provide an in-situ and real-time monitoring of the vacuum inside the chamber...
With the development of three-dimensional low temperature co-fired ceramic (LTCC) packaging substrate, the internal microscale structures have great effect on the strength, toughness and lifetime of LTCC microsystem, where the study of local or nanoscale mechanical properties and microstructure is critical, especial for the prediction of the local failure behaviors. In this study, the nanoscale mechanical...
This paper reports a bulk micromachined microwave tunable lowpass filter with its resonator tuned by butterfly-like loading bridges on Pyrex glass. Effectively, the filter is tuned by shifting the first transmission zero, and is based on 7th order ellipse architecture, whose use in RF MEMS filters has not been reported as far as the authors know. Perturbation method is used to anticipate analytically...
In this paper, the design and analysis of a bulk micromachined distributed digital microwave phase shifter is introduced. This device, with nonlinear delay line architecture, utilizes 12 butterfly-like microbridges on glass substrates as loading varactors to deliver true time delay performance. The loading capacitance switches between two values, with the pull-in and deformation of the microbridges,...
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