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Metallic wafer bonding is today becoming a key enable technology in MEMS packaging and heterogeneous integration. The Si/Al/Sn-Sn/Al/Si bonding structure with low temperature, low pressure and short bonding time is investigated in this paper. The bonded 4 inch Si wafers were diced into dies. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were applied for interface...
With the development of three-dimensional low temperature co-fired ceramic (LTCC) packaging substrate, the internal microscale structures have great effect on the strength, toughness and lifetime of LTCC microsystem, where the study of local or nanoscale mechanical properties and microstructure is critical, especial for the prediction of the local failure behaviors. In this study, the nanoscale mechanical...
In this paper, the design and analysis of a bulk micromachined distributed digital microwave phase shifter is introduced. This device, with nonlinear delay line architecture, utilizes 12 butterfly-like microbridges on glass substrates as loading varactors to deliver true time delay performance. The loading capacitance switches between two values, with the pull-in and deformation of the microbridges,...
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