The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We propose a new solder-free and low-temperature (200 °C or less) flip-chip integration technology for silicon photonic platforms. Au stud bumps are arranged facing each other on a substrate and a chip. Plastic deformation when the bumps are heated and pressed achieves Au-Au bonding. We measured mechanical and electrical characteristics (bonding strength, electrical resistance, and high-frequency...
We have developed a photonic receiver in which a 4-channel transimpedance amplifier (TIA) chip is integrated on a Si/Ge-based photonic circuit by using flip-chip bonding. The TIA outputs exhibit a clearly opened 25-Gbit/s eye pattern.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.