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We previously proposed a photonics-electronics convergence system to solve bandwidth bottleneck problems among large-scale integrations (LSIs) and demonstrated a high bandwidth density with silicon optical interposers at room temperature. For practical applications, the interposers should be usable under high-temperature conditions or rapid temperature changes so that they can cope with the heat generated...
We demonstrated athermal silicon optical interposers integrated with quantum dot lasers at 1.3 μm, achieving a bandwidth density of 15 Tbps/cm2 with a channel line rate of 12.5 Gbps operating up to 125 °C without any bias adjustment.
We demonstrated a 25-Gbps error-free data link on a silicon optical interposer. The experimental results verified that our interposer is compatible with high-performance FPGAs, and transmitter pre-emphasis and receiver equalization reduced bit error rate of the optical data link.
By integrating compact and high-speed silicon modulators and germanium photodiodes with light sources, we demonstrated a silicon optical interposer for inter-chip interconnects with a bandwidth density of 6.6 Tbps/cm2.
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