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Under bump metallization (UBM)–Al delamination is a high-value chip-package interaction reliability problem in flip-chip Cu pillar packaging. We devised a test vehicle for quick reliability assessment. We demonstrate that preclean is a critical step to ensure reliable UBM-Al adhesion and achieve bump shear strength >12 g/mil2 for 15-$\mu \text{m}$ polymer opening. Key parameters affecting bump...
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