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A monolithic multi-sensor for small unmanned aerial vehicles is presented in the paper; it consists of a three-axis piezoresistive accelerometer, a piezoresistive absolute pressure sensor and a silicon thermistor temperature sensor. The accelerometer is designed with four silicon beams supporting the seismic mass and appropriate piezoresistors arrangement to detect three-axis acceleration and greatly...
In order to satisfy the different packaging requirement of individual sensors in the monolithic multi-sensor chip, a hybrid packaging method is presented in the paper. The packaging method of multi-sensor makes use of high-resolution stereolithography system of photopatternable resin constructing the main packaging structure in the way of batch production, low cost and good resolution. A monolithic...
A monolithic multi-sensor for absolute pressure, temperature and humidity is packaged by the packaging structure of chip on board (COB). To investigate the packaging effect of the multi-sensor, the finite element method (FEM) is adopted for analyzing the packaging stress in the multi-sensor chip introduced by the mismatch of the thermal expansion coefficients (TCE) in the different materials. The...
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