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We have successfully fabricated a 3D super-capacitor, which can be integrated with MEMS in a wafer level, using Si trenches (aspect ratio = 53) and ultra-conformal supercritical fluid deposition (SCFD) of Cu/SiO2 layers. Taking advantage of large inner surface area of the trenches, the 3D capacitor exhibited 70 times larger capacitance than a planar one having the same projected area, and low leakage...
A novel supercritical fluid deposition method (SCFD) of SiO2 has been developed for polymer-based MEMS. In order to reduce deposition temperature for the application to polymer-based MEMS process, we selected O3 as an oxidant in SiO2-SCFD. Conformal SiO2 deposition on Si trenches (aspect ratio 24) at low temperatures (below 200°C) was achieved, which were acceptable for deposition on polymers. In...
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