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The moisture migrating into underfill decreases the adhesion strength, swells to deform the assembly, and weakens underfill mechanical and thermal properties. In this study, interfacial reliability of FCOB exposed at 85 degC/85%RH was studied using Moire interferometry and mu-DiSC system developed. A thermal aging study was simultaneously performed to understand the time effect on long duration of...
Solid-state intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The morphology and growth of interfacial IMC compounds between 95.5Sn-3.8Ag-0.7Cu Pb-free solders and nickel/gold (Ni/Au) surface finish on BGA solder joint specimen is reported. Digital imaging techniques were employed in the measurement of the average IMC...
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