Search results for: Hua-Chiang Wen
Surface and Interface Analysis > 50 > 5 > 541 - 546
Microelectronics Reliability > 2017 > 79 > C > 270-275
Microelectronics Reliability > 2017 > 78 > C > 111-117
Journal of Alloys and Compounds > 2017 > 693 > C > 615-621
Journal of Materials Science: Materials in Electronics > 2016 > 27 > 6 > 6452-6456
Journal of Alloys and Compounds > 2015 > 647 > C > 123-128
Journal of Alloys and Compounds > 2015 > 625 > C > 52-56
Tribology Letters > 2015 > 58 > 2 > 1-6
Journal of Physics and Chemistry of Solids > 2014 > 75 > 3 > 334-338
Applied Surface Science > 2013 > 264 > Complete > 45-51
Applied Surface Science > 2012 > 258 > 12 > 5001-5004
Microelectronics Reliability > 2011 > 51 > 12 > 2223-2227
Applied Surface Science > 2011 > 257 > 21 > 8887-8893
Journal of Physics and Chemistry of Solids > 2011 > 72 > 6 > 789-793
Microelectronics Reliability > 2011 > 51 > 5 > 931-935
Surface and Interface Analysis > 43 > 5 > 918 - 922
Microelectronics Reliability > 2010 > 50 > 8 > 1111-1115
Microelectronics Reliability > 2010 > 50 > 6 > 851-856
Applied Surface Science > 2010 > 256 > 11 > 3464-3467