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The interfacial voids in Ni 2 SnP were studied by high-resolution transmission electron microscopy. These voids were found to be responsible for many types of failure in electronic solder joints, but so far, detailed investigation of these voids has been pursued in a only few studies because of the need for advanced analytical techniques. The interaction of Sn 3 Ag 0.5 Cu with...
Shock-wave deformation of tantalum to a pressure of 45 GPa and duration of 1.8 μs generates profuse twinning. The post-shock mechanical response is significantly affected, with shock hardening exceeding the expected hardening due to the transient shock strain ϵs = ( 4 3) ln( V V0); this enhanced hardening, and other alterations in response, are attributed to the barriers presented to plastic deformation...
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