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For revealing the influences of thermomigration effect (TM) on the creep properties of interconnecting solder joints in electronic packaging industry, the creep behavior of Cu/Sn0.7Cu/Cu solder joints were researched under temperature gradient of 1043°C/cm and isothermal temperature of 100°C(median temperature) with different shear stress, respectively. It is approved that the creep lifetime of the...
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