The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this study, roughened Ni/Pd/Au-Ag alloy-plated Cu leadframe and two types of mold compounds (A and B) were studied in terms of button shear tests on the leadframe surfaces and package performance after assembly and after reliability stresses. The package reliability stresses include pre-conditioning at Moisture Sensitivity Level 3 (MSL3) with three cycles of reflow at 260 °C (peak temperature)...
An Ag spot/full nickel and nickel phosphorus (NiNiP)-plated Cu leadframe without the anti-tarnish layer was used for aluminum wire bonding in power packages. Two periods of shelf-life, namely 7 months and 13 months, of the leadframe were studied in terms of processability (die attachment and wire bonding) and package reliability. It was found that the leadframe with 7-month shelf-life showed positive...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.