The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Compact antenna arrays are more and more used in mobile terminals with MIMO technology. However, mutual couplings between the radiation elements degrade the performance of arrays with respect to radiation efficiency, diversity, impedance matching and so on. In this paper, a simple compact three-element printed diversity array operating around 6 GHz is designed and measured. This array consists of...
Through-silicon-via (TSV) enables vertical connectivity between stacked chips or interposer and is a key technology for three-dimensional (3D) ICs. In this paper, we study the signal integrity issues of TSV-based 3D IC with high-speed signaling based on 3D electromagnetic field solver and SPICE simulations. Unlike other existing works, our study focuses on an array of TSVs and includes power and bandwidth...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.