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Three-dimensional (3-D) digital image correlation (DIC) has been gradually adopted by industry these years. This method utilizes a pair of cameras to accumulate and correlate images through tracking the movement of features on the specimen surface in real time. It is capable of generating both in-plane and out-of-plane deformation during one test. To some extent, it is perfect to be utilized in the...
III–V compound semiconductors have stirred a significant interest over the recent years, due to their advantageous carrier transport properties [1,2]. Particularly, the high hole mobility makes GaSb very attractive for the p-channel MOSFET application [3]. Although many techniques have been developed to improve the performance of GaSb MOSFETs [4], effects of strain engineering on GaSb MOSFETs have...
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