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As the failure of solder joints under thermal cycling is as a result of creep-fatigue damage evolution, the failure mechanism of SnAgCu solder was studied by using the theory of continuum damage mechanics (CDM) and a new damage model was proposed here. A special bimetallic load frame with single joint-shear sample was designed to simulate actual joints in electronic packages. Thermo-mechanical cycling...
Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder joints were investigated by accelerated aging experiments and finite element analysis (FEA). Results...
SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of flip chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of flip chip is...
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A...
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