The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, Ti-doped GaZnO (GTZO) quaternary alloys were used as the transparent conductive oxides (TCOs) for Cu(In, Ga)SeSe2 (CIGS) solar cell application. These thin films are highly favorable for solar power systems. Photoluminescence measurement and X-ray diffraction were employed to investigate the GTZO thin films. Advantageous crystal quality was produced by radio-frequency magnetron sputtering...
The molded underfill (MUF) process for system in package (SiP) assembly has been applied for years and is still in production. However, the shrinkage in package size, cost reduction and improving electrical performance are driving the development of dual side molding package. The development of dual side molding technology faces the challenge of moldability. The moldability is largely influenced by...
The system-in-Package (SiP) module market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by lower cost, smaller form factor, higher levels of integration and better performance. In addition, for handheld and mobile application the coreless substrate had been evaluated to replace buildup coded...
The Embedded die in substrate (EDS) market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by smaller form factor, better heat dissipating, low noise emission, higher levels of integration and better performance. In addition, for power management and mobile-wireless application the embedded technology...
We report that the angular and periodic dependence of the surface-plasmon-polaritons in gold nanodisks can be suppressed by nanorod substrates, which decreases the dipolar coupling and enhance their localization.
This paper investigates terahertz (THz) wave propagation, resonance, and radiation on a THz optoelectronic integrated circuit (THz-OEIC). An efficient THz resonant radiation from 0.6 to 0.7 THz can be achieved with a newly designed 2-D open-ended rampart slot array antenna. A monolithically integrated circuit is fabricated on a localized THz resonant cavity, which not only provides a robust base for...
The rational of using the coreless technology to build packaging substrates versus the conventional core approach is first described. Substrate structures are compared to illustrate the simplicity and advantages of the coreless approach over that of the core. Coreless product examples, including the design rules are shown for both the ABF and the BT/Hitachi materials. Developmental results of the...
The CBCPW-fed bilateral slot loop antenna has been presented. By introducing an auxiliary slot underneath the slot loop, not only the slotline mode appears but also the microstrip mode exists, which could be used to excite the slot loop and coplanar patch antenna, respectively. Compared with the CPW-fed slot loop antenna, besides the 1st and 2n slot loop resonances, the coplanar patch resonance also...
Pre-bond test is preferred for a three-dimensional integrated circuit (3D IC), since it reduces stacking yield loss and thus saves cost. In this paper, we present two schemes for testing through-silicon vias (TSVs) by performing on-chip screening before wafer thinning and bonding. The first scheme is for blind TSVs, which have one end floating, using a charge-sharing technique commonly seen in DRAM...
Design and analysis of a conductor-backed coplanar waveguide (CBCPW) fed circular coplanar patch antenna are presented and compared with microstrip line-fed one. Similar performances such as resonant frequency, gain, and radiation patterns are observed between them in both TM11 and TM12 modes. When via-holes are placed alongside the CBCPW feed-line and surrounding the circular patch, the side plane...
By making use of the dc magnetron sputtering system, the Au/FePt bilayers have been prepared on a glass substrate and an anodized aluminum oxide (AAO) membrane with an averaged pore diameter of around 20 nm and 200 nm. All the FePt films can be converted into the magnetic hard phase, namely L10 phase, after a heat treatment above 500??C for 1 hour. A nanoparticle-like structure can be observed in...
In flat panel displays, the assembly format of driving ICs, due to the rectangular chip shape, is usually with a difference of conventional commercial ICs constructed with a square configuration. Because of this concern, the electroplating gold bump technology in package was desirably developed. Additionally, in the characteristics of hardness, melting point, and stability, gold material is generally...
Due to the low profile and the simple structure, the planar monopole antennas and the planar inverted-F antennas (PIFA) have been very attractive in the mobile handset applications. Although the planar loop antennas possess similar features, they have not been discussed extensively. Moreover, the urging requirement for multi-band operations makes the handset antenna design more and more challenging...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.