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This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pre-assembly and assembly process steps. And all the process steps after and including WLUF lamination have to be co-optimized to ensure the integrity of...
Technical innovation drives the low power consumption requirements in ASIC design. This paper presents a SD card controller, in which two asynchronous units (BIU and CIU) are included for lower power structure. Adding low power mode to finite state machine makes this controller to shut down if no data or command is transferring for a long time. Only one FIFO is used to store temporary data in order...
The rapid progress of manufacturing nanoscale devices is pushing researchers to explore appropriate nanoscale computing architectures for high density beyond the physical limitations of conventional lithography. However, manufacturing and layout constraints, as well as high defect/fault rates expected in nanoscale fabrics, could make most device density lost when integrated into computing systems...
Improvements in manufacturing and assembly of novel devices such as the carbon nanotube (CNT) and semiconductor nanowires has led to the exploration of new nano-architectures utilizing such devices for applications such as general purpose computing, image processing etc. This paper discusses different possible nanoscale implementations of cellular neural networks (CNN). It is seen that while an analog...
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