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In sputtering deposition process of TiO2, metal Ti or sintered TiO2target is used as deposition source. In this study, we have compared the characteristic of target materials. When TiO2target was used, stoichiometric TiO2films was deposited under the Ar atmosphere containing 1.0% of oxygen. The highest sputtering rate under this atmosphere was 3.9nm/min at 3.4W/cm2. But, sintered TiO2target is fragile...
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