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This paper describes a compartment shielding process which is suitable for a system module which needs multiple shielded areas to reduce the interference among digital, analog and RF circuits. The process to implement this compartment shielding is ideal for integrating die or wafer level package, and results in miniaturized form factory both in area and in height. The compartment shielding structure...
A direct-conversion transceiver including base-band amplifiers and filters employs a 60-GHz quadrature VCO and a feedforward divider with no buffers to achieve a low power consumption. Designed in 40-nm LP CMOS, the radio presents a noise figure of 4.8 to 8.2 dB in the receive mode and an output power of +10 dBm in the transmit mode while drawing 56 mW and 124 mW, respectively.
We present design and development of a low-cost, quad flat no-lead (QFN) package that operates over DC to 40 GHz frequencies and is fully compatible with existing leadframe processes. Further, we discuss a novel technique to characterize the package interconnect that first involves removal of plastic from the package. Once the die-paddle is exposed, a probe-ready alumina substrate adapter is inserted...
This paper presents a new wafer level packaging (WLP) technique that combines thin, low cost organic layers with high performance MMICs. More specifically, we present a GaAs-based single stage amplifier covered with layers of a low loss liquid crystal polymer organic material. It was observed that the RF performance of the MMIC is virtually unaffected by this technique unlike conventional packaging...
This paper presents a study on the contact resistance of interconnects between chip and package of embedded chip technology. Multi-layered aluminum/titanium tungsten/copper interconnects (Al/TiW/Cu) were used as the model system. Design of experiment was carried out to characterize the effect of under bump metallurgy deposition steps, including the degas and radio frequency (RF) plasma etch steps,...
We proposed RF direct-detection vector signal generation using optical I/Q up-conversion. The Gram-Schmidt orthogonalization procedure is employed to compensate I/Q imbalance. After transmission over 100-km SMF, penalties of 5-Gb/s QPSK signals can be ignored.
Hybrid access network integrated with multi-level wireless vector signal and wireline OOK signal without optical filter is proposed for the first time. 312.5-MSymbol/sec RF 8-PSK signal and 1.25-Gb/sec BB signal are experimentally demonstrated.
The generation of optical millimeter-wave with frequency 8-tupling is experimentally demonstrated. 625-Mb/sec QPSK data transmission at 105-GHz (W-band) is achieved for the first time using the millimeter-wave generation technique and direct modulation of a NBUTC-PD.
A novel all optical WDM up-conversion system using frequency quadruple technique is proposed. The proposed system can be utilized in the future 60-GHz band WiMAX RoF system.
A multi-services hybrid access network has been experimentally demonstrated. The scheme has no RF fading issue; can carry vector signals, and requires no optical filter at remote nodes.
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