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In this correspondence, we propose a procedure to estimate the yield strength of thin films by debonding films from their substrate by elastic-plastic buckling under thermally induced compressive loading. The out-of-plane displacement of the metal lines under conditions of elastic-plastic buckling is dependent on the yield strength of the film. Thus, an inverse estimate of the yield strength is made...
Thin films bonded to substrates commonly occur in semiconductor dielectric stacks. In these systems, many times, the mismatch in the coefficient of thermal expansion between the films and the substrate result in significant compressive stresses during processing. These compressive stresses may lead to instabilities such as buckling or wrinkling, possibly resulting in debonding of the films. In general,...
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