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Wrinkling is a mechanical instability occurring in multi-layer structures comprising a thin and stiff layer resting on a supporting underlying compliant layer. The present study is motivated by experimental observations of wrinkling leading to irreversible deformation and to the initiation of defects. An incremental Spectral Method is employed to solve the governing differential equations. This approach...
Interfacial fracture toughness measurements of thin film-substrate systems are of importance in many applications. In the microelectronics industry, the interfacial adhesion between the dielectric-barrier-metal layers on a semiconductor chip is critical for chip reliability. In this paper, we propose a thermally-driven patterned buckling delamination test that does not use a pre-existing weak interface...
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