The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Capacitive Coupled Transmission Line Pulsing (CC-TLP) has successfully identified a known CDM weakness at the RF inputs of two different 90 nm CMOS RF products. The presented study compares electrical and physical failure signatures for packaged devices and even for devices stressed at wafer level. The peak stress currents resulting in a failure as well as the failure signatures correlate very well...
This paper shows that device robustness for system level ESD scales linearly with device width. Relations between system level failure voltages and TLP failure currents are established. Most compound structures follow the same relations. The exceptions have a different failure mechanism, which is shown to correlate with vf-TLP characterisation. The results enable predictive simulations for system...
This paper describes a new test method called Capacitively Coupled Transmission Line Pulsing cc-TLP. It is applied to different test circuits which were mounted on specially designed package emulators with a defined background capacitance. The test results are compared with the ESD thresholds obtained by CDM tests. The CC-TLP results correlate well with the CDM data.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.