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A novel approach of high-performance grinding is proposed using developed diamond wheels, to obtain minimally damaged surface layer in silicon wafers. For this reason, resin bond diamond wheels are specifically developed with lanthanum oxide (La2O3), magnesium oxide (MgO), and ceria (CeO2) as additives, respectively. The wheels contain grains with a mesh number of 20,000 and a volume fraction of diamond...
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