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In this paper, the through silicon via (TSV) blind holes with a diameter of 50μm and a depth of 150μm were prepared by MEMS micromachining technology. The Cu micro-cylinders (Cu-TSVs) were obtained by electrodepositing Cu in the blind holes using a direct current power. The mechanical properties of Cu-TSVs were measured using a self-made micro-compression system. The effect of current density on the...
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