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In this paper, we have developed a new structure to suppress 3D noise coupling in 3D silicon substrates. This technique consists of contact arrays and grid ground planes. The contact arrays suppress the low-frequency noise while the grid ground suppresses the high-frequency noise. This isolation method can be used for noise suppression between circuits and/or TSVs, and it can be applied in 3D ICs...
Wireless power transfer (WPT) system is to provide power transmission via near field magnetic resonant coupling between the transmitter and the receiver with the same frequency. In WPT system the most important parameter is efficiency. This paper proposes different cooperative transmitter matrixes with multiple coils. This design enables receiver coil to be freely placed and charged above the wireless...
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