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Three-dimensional (3D) die stacking based on the Through Silicon Via (TSV) is a promising new packaging technology for its high performance, multi functionality, relatively smaller chip size and lower cost etc. However, the application of TSV in 3D SiP will introduce lots of new problems regarding the reliability, such as thermal stress, deformation, fatigue failure In this study, the thermal-mechanical...
As multiple layers of planar device are stacked to alleviate signal delay problem and reduce chip area, Through silicon via (TSV) is introduced to replace the large number of long interconnects needed in previous 2D structure. However, the thermal-mechanical reliability problems of TSVs, such as interfacial delamination, via cracking and so on, have become a serious reliability concern. In this paper,...
Virtual Scene Technology is one of the important parts of VR systems. It takes charge of Vision issue in VR systems, and is the most important fact to affect the immersive of the system. There are many problems in training simulation of artillery reconnaissance radar, such as the battlefield environment isn't living, the load of assemble and disassemble is large, the training cost is high. The virtual...
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