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In this study, an on chip bus driver TEG (test element group) has been developed for the data transmission performance at TSVs for 3D IC integration. The on chip bus driver TEG consists of transceiver (TX), receiver (RX) and TSV group which has 2, 4 and 8 TSVs for the analysis of the TSV transmission performance with different load effects which are caused by different number (2, 4, and 8) of chip...
This letter describes a triple-feed Y-shaped slot antenna for designing an RFID tag for metallic objects, which can be directly integrated in metallic plates or structures. The unique feature of the design is that the tag can function effectively with three different RFID chips, whose impedances vary widely. An important advantage of this feature is that the tag does not have to be redesigned to work...
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