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A novel interconnect technology was reviewed, which was developed for three-dimensional (3-D) ultra-compact MMICs. Using O 2 /He RIE for the through hole and trench formation of a thick polyimide insulator layer, low-current electroplating for gold sidewall formation in the through-holes and the trenches, and ion-milling with WSiN metal stopper for gold patterning, a complete three-dimensional...
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