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In this paper, the radial pulse waveforms of the same subjects under various contact pressures were measured. Then, the feature points of the pulse wave contours were extracted and the physical parameters were calculated corresponding to different contact pressures. The various trends of parameters, including peripheral augmentation index, peripheral subendocardial viability ratio, and peripheral...
Novel technology enablers for high-performance three-dimensional (3D) system integration are demonstrated in this paper: (a) A thick silicon interposer with 65 µm diameter and 370 µm tall low-loss polymer-embedded vias on a 150 µm pitch is fabricated and characterized demonstrating a 78% reduction in insertion loss compared to similar-sized conventional TSVs at 50 GHz; (b) Two dice with embedded microfluidic...
A novel chip I/O technology, which enables high-bandwidth signaling, embedded microfluidic cooling and power delivery for high-performance 2.5D (silicon interposer) and 3D integrated circuits is presented. It features annular-shaped fluidic microbumps with 150 μm inner diameter and 210 μm outer diameter and fine-pitch electrical microbumps with 25 μm diameter and 50 μm pitch. Silicon dice with the...
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