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Jet dispensing is one of the key technologies in LED packaging as the consistency of the dispensed volume can directly affect the LED color and quality. Studying the dynamics of silicone-phosphor during the jet dispensing process is of great value. In this paper, a multi-physical model was developed and verified by the experiments. The silicone-phosphor thread profile during the jet dispensing process...
In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from −26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm2) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW...
We systematically study the packaging effect on the performance of CMOS Thermoresistive Micro Calorimetric Flow (TMCF) sensors, including two types of sensor packaging designs: S-type and E-type. For S-type design, the experimental results indicate that not only the sensitivity of TMCF sensors was significantly changed by more than 30%, but also the flow range compared to the E-type design was dramatically...
Radio frequency identification (RFID) is quickly gaining a foothold in the identification and security industry. However, one major roadblock that prevents companies in adopting RFID technologies is its high manufacturing cost, particularly assembly cost. One approach to reduce the assembly cost is using surface mount technology. Currently anisotropic conductive adhesives (ACA) tape, isotropic conductive...
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