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A series of single-phase water microgap cooling experiments (gap height: 200 μm) are conducted on via arrays in 400 μm thick glass interposers. Surface temperature rise is compared to trials run with bulk Si of the same thickness. The results show that the copper vias are necessary to control the temperature rise of the glass substrate, and that while the via-enhanced interposers do exhibit a larger...
We propose a two-pronged approach to reducing the impact of thermal cross-talk between components of disparate thermal operating points within a heterogeneously integrated electronic package. First, a low thermal conductivity interposer enhanced with an array of conductive thermal vias is employed to provide a high degree of lateral thermal isolation while providing adequate conduction in the vertical...
The dissipated power of insulated gate bipolar transistor and high electron mobility transistor amplifiers is typically nonuniform, resulting in areas of elevated temperature, or hotspots, which can have very large heat fluxes, on the order of 1000 W/cm2. While various bulk cooling systems are being researched to remove large amounts of heat, they uniformly reduce the chip temperature, leaving the...
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