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3D-Printing, or Additive Manufacturing, has received significant media attention during the last five years. A number of companies are now commercializing materials, design tools, and 3D-Printers and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products. But what impact is 3D-Printing having on electronic packaging and...
This paper discusses the effect of five process parameters on the generation of post weld stresses in the pigtail fibre optic. The alignment of the fibre optic and the laser in the butterfly module become misaligned during the laser welding process of the sleeve to the ferrule. This is primarily due to post welding stresses in the fibre optic which develop during the cooling process. The mechanical...
Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use...
Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use...
Encapsulant curing using a Variable Frequency Microwave (VFM) system is analysed numerically. Thermosetting polymer encapsulant materials require an input of heat energy to initiate the cure process. In this article, the heating is considered to be performed by a novel microwave system, able to perform the curing process more rapidly than conventional techniques. Thermal stresses are induced when...
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