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Silicon nitride (Si3N4) ceramics offer excellent thermal, mechanical and dielectric properties, which make Si3N4 a good candidate material for an application as electronic packaging material. For an application as a heat dissipation substrate, most studies focused on achieving a high thermal conductivity through long-time heat preservation and different kinds of heat treatments. Very few studies also...
The effects of Cr2O3 derived from Cr(NO3)3·9H2O precursor on the densification, microstructure and mechanical properties of zirconia-toughened alumina (ZTA) ceramics were investigated. The Cr2O3 content in ZTA varied from 0 to 0.8wt%. Cr2O3 derived from Cr(NO3)3·9H2O can form solid solutions with Al2O3 and ZrO2 in ZTA more efficiently than Cr2O3 additive directly added to ZTA. The precursor-derived...
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