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The authors have found that the Young's Modulus and the shrinkage behavior of the packaging resin are greatly affected by the constraint condition, especially during the curing process. The purposes of this study are to propose the measuring method of property of the resin considering the process condition and to verify the results from experimental and analytical models. Therefore, it has been understood...
Today, the semiconductor device is used in all kinds of electronic equipment that we are usually using. And, it can be said that most of the function is realized by the integrated circuit in the silicon chip. The silicon chip is very delicate. Therefore, it has to be packaged by resin material to protect from the external environment and to let the heat of the chip go outside efficiently. Recently,...
Since the flexural rigidity of thin semiconductor package become much lower than normal components, the warpage of the component become a much more important issue to evaluate the reliability. In this study the author's proposal a new practical shrinkage method to measure the real time curing deformation and the elastic modulus resin during the whole curing process. the thermal deformation of the...
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