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Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due...
This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
The fatigue life considering dispersion of solder joints on chip resistor was investigated by experimental approach and analytical approach. The significant difference of crack propagation ratio was found each specimen by experimental approach. However, it is difficult to clarify the reasons of the difference for the fatigue life of solder joint quantitatively. So, the analytical approach that estimates...
As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity...
Recently, the electronic device equipments using a lot of semiconductors are widespread to all industrial fields. Solder joints are used to mount the electronic chips, such as ceramic resistors and capacitors, on the printed-circuit boards in almost all electronic devices. However, since in many cases the thermal expansion coefficients of electronic parts and PCBs have mismatch, cyclic thermal stress...
The purpose of this study was to analyze the drop reliability of solder joints in assembled IC package on print wiring board (PWB) from viewpoint of structure of test equipment. Considering reliability of mobile devices, it was important to establish the drop reliability for solder joints. In this paper, the repetitive drop test with simple equipment was carried out to evaluate the drop reliability...
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