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Na-doped CuInS2 (Na-CIS2) thin films were fabricated by a non-vacuum ink process. The copper (Cu), indium (In) and sulfur (S) precursors were first synthesized by a sonochemical colloidal route, which is simpler and cheaper than the other preparation methods. The CuInS2 (CIS2) thin film absorber layers were then formed via spray-coating method using ink precursors consisting of Cu, In and S components...
The root cause and an approach to lifetime expectation of bi-modal distribution in Cu/low-k interconnect have been elucidated through experimental and simulation results. The early mode with short failure time and voids at via bottom interface, could be explained by pre-existing voids and large current density resulting from gouging via bottom profile. A high compressive SiCN making Cu/SiCN interface...
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