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In recent years there has been an increasing demand of aluminum solder pastes used for automated assembly of LED lighting components, such as heat sinks and supporting frames of LED modules. However, it is well-known that soldering of aluminum and its alloys at low soldering temperatures has long been difficult. In this study, the effects of flux activators (i.e., zinc salt A and B, and tin salt A)...
Momentum wheel is the main execution unit for the attitude control of three-axis stabilized satellite. On the long-life satellites, momentum wheels are often required working stably and reliably for several years or even ten years. It is necessary to evaluate the remaining life of on-orbit satellite momentum wheel. The failure mechanism of momentum wheel is very complex and it is difficult to predict...
Multi-arc ion plating was used to deposit TiN films to modify the 316L stainless steel brackets for orthodontic applications. XRD, SEM, Raman spectroscopy, electrochemical analysis, cell proliferation and enzyme-linked immuno sorbent assay (ELISA) were applied to compare the surface characteristics of TiN coated and uncoated stainless steel brackets. It was found that TiN coating is smooth, hard,...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
During soldering process employing Sn-based lead-free solders, an intermetallic compound (IMC) layer forms between the molten solder and pad/under bump metallization (UBM), whose morphology and thickness play an important role in controlling the service performance of the solder joints, in particular for solder interconnects with the decreasing size where the interfacial IMC layer takes up a high...
Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, Cu)3Sn4 IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the...
The rapid development of modern electronic devices and products has proposed a great demand for the continuous scaling down in the dimension of solder joints and interconnect pitches in packaging; accordingly the current density in solder interconnects gets higher and higher. The higher current density can easily result in electromigration (EM) which has been regarded as a serious reliability issue...
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