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Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
Solder joints in the electronics products are considered as critical reliability concerns. In this research, a quantitative evaluation of fracture mechanics parameters (such as Stress intensity factors (SIF, K I and K II ) and kink angle, θ) in the IMC layer for SnPb and Pb-free solder joints has been carried out. Computation methods are based on finite element numerical modelling...
Ball shear test is the most common test method used to assess the reliability of bond strength for ball grid array (BGA) packages. In this work, a combined experimental and numerical study was carried out to realize of BGA solder interface strength. Solder mask defined bond pads on the BGA substrate were used for BGA ball bonding. Different bond pad metallizations and solder alloys were used. Solid...
The effect of a high electric current density on the interfacial reactions of micro ball grid array solder joints was studied at room temperature and at 150°C. Four types of phenomena were reported. Along with electromigration-induced interfacial intermetallic compound (IMC) formation, dissolution at the Cu under bump metallization (UBM)/bond pad was also noticed. With a detailed investigation, it...
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