Search results for: Hui Chu
International Journal of RF and Microwave Computer‐Aided Engineering > 30 > 5 > n/a - n/a
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 956 - 963
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 4 > 347 - 349
IEEE Microwave and Wireless Components Letters > 2015 > 25 > 1 > 10 - 12
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 7 > 442 - 444
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 6 > 379 - 381