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A flip-chip packaged two-dimensional (2-D) thermal flow sensor fabricated in CMOS technology is presented. The sensor consists of polysilicon resistor heaters, Al/polysilicon thermopiles, and a substrate bipolar transistor located in the center of the sensor chip. The thermopiles and the transistor were used to measure the change of the flow-induced temperature distribution on the flow-sensing surface...
A flip-chip packaged thermal flow sensor is presented. The sensor chip was fabricated by standard CMOS technology and it consists of polysilicon resistor heaters, Al/polysilicon thermopiles and a substrate bipolar transistor in the center of the sensor chip. The sensor chip was flip-chip packaged on a thin ceramic substrate using copper pillar bump technology. Heat transfer is performed between the...
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