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3D integration is an emerging technology that allows for the vertical stacking of multiple silicon die. These stacked die are tightly integrated with through-silicon vias and promise significant power and area reductions by replacing long global wires with short vertical connections. This technology necessitates that neighboring logical blocks exist on different layers in the stack. However, such...
One of the challenges for 3D technology adoption is the insufficient understanding of 3D testing issues and the lack of DFT solutions. This article describes testing challenges for 3D ICs, including problems that are unique to 3D integration, and summarizes early research results in this area. Researchers are investigating various 3D IC manufacturing processes that are particularly relevant to testing...
Die stacking is a promising new technology that enables integration of devices in the third dimension. Recent research thrusts in 3D-integrated microprocessor design have demonstrated significant improvements in both power consumption and performance. However, this technology is currently being held back due to the lack of test technology. Because processor functionality is partitioned across different...
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