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This paper proposes a new prediction method for electromigration (EM) induced void generation of solder bumps in a wafer level chip scale package. The methodology is developed based on discretized weighted residual method in a user-defined finite element analysis framework to solve the local ME governing equation with the variable of atomic concentration. The local solution of atomic concentration...
This paper proposes a parametric simulation plan for UBM geometry with different UBM rim angles, diameters and thicknesses. The parameter plan for the solder bump with different heights and diameters, and different shapes is also investigated. The goal of this study is to understand the impact of the die shrinkage on solder joint reliability under electromigration failure, and to optimize the UBM...
This paper studies the numerical simulation method for electromigration in the solder joint of a chip scale package. The three dimensional electromigration finite element model for solder joint reliability is developed. Numerical experiments are carried out to obtain the electrical, thermal and stress fields with the migration failure under high current density loads. The indirect coupled analysis...
This paper studies the numerical simulation method for electromigration in IC device and solder joint in a package under the combination of high current density, thermal load and mechanical load. The three dimensional electromigration finite element model for IC device/interconnects and solder joint reliability are developed and tested. Numerical experiment is carried out to obtain the electrical,...
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