Search results for: Seung-Boo Jung
Microelectronic Engineering > 2018 > 198 > C > 15-21
Microelectronic Engineering > 2017 > 180 > C > 52-55
Journal of Alloys and Compounds > 2017 > 699 > C > 1186-1191
Journal of Alloys and Compounds > 2017 > 693 > C > 688-691
Applied Surface Science > 2016 > 380 > C > 223-228
Microelectronics Reliability > 2016 > 63 > C > 120-124
Current Applied Physics > 2015 > 15 > Supplement 1 > S36-S41
Journal of Alloys and Compounds > 2015 > 627 > Complete > 276-280
Journal of Alloys and Compounds > 2014 > 615 > Supplement 1 > S411-S417
Microelectronic Engineering > 2014 > 120 > Complete > 77-84
Microelectronic Engineering > 2014 > 120 > Complete > 216-220
Microelectronics Reliability > 2014 > 54 > 2 > 410-416
Microelectronics Reliability > 2013 > 53 > 12 > 2036-2042
Thin Solid Films > 2013 > 547 > Complete > 120-124
Current Applied Physics > 2013 > 13 > Supplement 2 > S190-S194
Microelectronic Engineering > 2013 > 107 > Complete > 114-120
Microelectronic Engineering > 2013 > 107 > Complete > 121-124
Microelectronic Engineering > 2013 > 106 > Complete > 27-32
Intermetallics > 2013 > 35 > Complete > 120-127
Journal of Alloys and Compounds > 2013 > 554 > Complete > 162-168