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We present for the first time a fully operational 77-GHz silicon-germanium (SiGe) single-chip four-channel transceiver module with four integrated antennas assembled in an embedded wafer-level ball grid array (eWLB) package. This eWLB module has a size of 8 mm × 8 mm and a footprint with a standard ball pitch of 0.5 mm. The module includes four half-wave dipole antennas that are realized using the...
The embedded wafer level ball grid array (eWLB) is a novel packaging technology that shows excellent performance for millimeter-wave (mm-wave) applications. We present simulation and measurement results of single-ended and differential transmission lines realized using the thin-film redistribution layers (RDL) of an eWLB. We demonstrate the capabilities for the integration of passives on example of...
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