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The effects of Ti content on the evolution of metallization layer and microstructure and shear strength of copper / alumina brazed joint were investigated. A good bonded metallization layer in β-Sn matrix containing Ti6Sn5 phases was obtained on the surface of alumina at 900°C for 30min. Active Ti dissolved into liquid SAC and reacted with alumina to form TiO layer resulting in the spreading of melt...
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