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Copper films with (111) texture are of crucial importance in integrated circuit interconnects. We have deposited strongly (111)-textured thin films of copper by atomic layer deposition (ALD) using [2,2,6,6-tetramethyl-3,5-heptadionato] Cu(II), Cu(thd) 2 , as the precursor. The dependence of the microstructure of the films on ALD conditions, such as the number of ALD cycles and the deposition...
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