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Crystalline Si (c-Si) solar cell production has reached an annual scale of ∼20 GW globally. Development of this leading technology has been boosted by continuous innovation in material science and reduced material and processing costs. An example of such innovation is the step-wise progression to more lightly doped emitters (LDE) that reduces recombination in the solar cell. Continuous improvement...
A photonic crystal substrate exhibiting resonant enhancement of multiple fluorophores has been demonstrated. The device, fabricated uniformly from plastic materials over a ~3×5 in2 surface area by nanoreplica molding, utilizes two distinct resonant modes to enhance electric field stimulation of a dye excited by a λ = 632.8 nm laser (cyanine-5) and a dye excited by a λ...
Controlled collapse chip connection - new process (C4NP) technology is a novel solder bumping technology developed by IBM to address the limitations of existing bumping technologies. Through continuous improvements in processes, materials and defect control, C4NP technology has been successfully implemented at IBM in the manufacturing of all 300 mm Pb-free solder bumped wafers. Both 200 mum and 150...
Summary form only given. The fabrication of flexible, and optically transparent, arrays of microplasma devices having microcavities fabricated by a polymer-based, replica molding process is reported. This process enables arrays of microcavity plasma devices or microchannels with feature sizes as small as ~ 10 mum to be produced inexpensively and precisely over surface areas of at least tens of cm2...
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