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This paper presents a thermal analysis result for a 3D heterogeneous embedded system integration MorPACK (morphing package) platform. The MorPACK platform is stacked by heterogeneous submodules composed of bare dies, a substrate, connection bridges, and solder balls. Since the tiny, heterogeneous and integrable characteristics of MorPACK platform, it needs to be fabricated in high-density and laminar...
The thermal capacity of unit volume is increasing with the development of 3D IC package density. The technology of thermal analysis and thermal design for 3D package becomes more and more important. This paper analyzes the structure and working mode of a particular 3D SRAM component. The thermal distribution is simulated with the ANSYS software in which the finite element method is applied. The simulation...
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